OU College of Engineering researchers to transform wireless communication
OUCE principal and ECE professor P Chandra Sekhar and his team of researchers comprising PhD scholars, MTech and BTech students are developing the Bluetooth chip in 1mm/1mm size, which works at a frequency of 2.48 Ghz
Hyderabad: The Osmania University College of Engineering (OUCE) researchers are on the brink of transforming the future of wireless communication. The Electronics and Communication Engineering (ECE) department researchers are developing a Bluetooth chip design that is not only half the size of the existing one but also significantly more cost-effective.
OUCE principal and ECE professor P Chandra Sekhar and his team of researchers comprising PhD scholars, MTech and BTech students are developing the Bluetooth chip in 1mm/1mm size, which works at a frequency of 2.48 Ghz.
The present Bluetooth chips used in various electronics gadgets, including the earphones and mobile phones, are of 2mm/2mm size. Using cutting-edge materials and technologies, the team is creating the chip design that maintains a high performance and resolution.
One of the unique features of the chip is its ability to consume less power compared to the existing ones and occupy less space given its reduced size. “The chip will have high resolution and accuracy, and largely reduces the noise distortion,” the researchers told ‘Telangana Today‘ .
The research project was undertaken as part of ‘The Design, Fabrication, and Development of Silicon Proven IP Core for High-Resolution All Digital Phase Locked Loop’ from Chip to Start-up (C2S) programme, Ministry of Electronics and IT (MietY).
While the OUCE is playing the lead role in executing the project jointly with CBIT, the BITSILICA Pvt Ltd, semi-conductor design services, is the end user which commercialises the developed chips.
Apart from receiving a grant of Rs 2 crore, the Central government extended necessary software that has come in handy for the team in designing the chip. While 90 per cent of the chip design has already been completed, the first design will be submitted to the central government in the month of October.
An integrated circuit will be manufactured at a facility in Chandigarh and it will be further improved based on its function. “Indians have all expertise for creating the chips but there needs to be enough support and guidance from the government. Soon, the country will become a hub for chip making as well given the capabilities of engineers here,” said Prof. Chandra Sekhar.
